I'll need to take a look at the board files (I assume Gerbers), and think from what I have read that the Toshiba FETs, external heatsinks (dynahifetrhs.zip) is the one I want to look at?
As for the schematic, there is a pair of devices in it... these double to 4 total, the additional pair in parallel with the existing pair I assume (including addl drain resistors (is that the right term))?
Dual parts: thru matching, I think you can get better matches than the duals give you... one of my duals has to be 20% off in matching. For the dual BJTs, would something like 2SA970/2SC2240 be a good substitute?
A couple of requests on the boards: I always felt the pad sizes on the Dynalo/Dynahi group buy boards were too small, making soldering connections to the ground plane or power planes difficult, and making desoldering from these same areas really hard. Secondly, the footprint used for the dual parts on the Dynahi boards did not allow the use of Zip sockets to socket the devices. The Zip sockets I feel are a must to allow, even though we will be using pairs of single devices here. Like I said, I'll look at the gerbers.