I think it may well have been. The way I read it, Ultrastick is a paraffin based substance which has been on the market for at least a decade (which can still mean it is good of course). I am not in a position to say whether it is better or worse than anything else, and indeed I was planning to use it with BeO isolators about a decade ago when I was looking at it. It seems lovely application wize. However, there is nothing on initial thermal performance, only a suggestion that thermal performance is constant over time, and better than something else (and they don't say what this is). Besides, based on paraffin it is actually flammable, and will evaporate at high temperatures - but sure, it cleans up nicely.
The way I read the second reference (tapes), I do have some experience with thermal tapes, also from the CPU world, and I don't like them one single bit. It is true that new materials that have recently entered the heatsink market may be very very good indeed - graphite based materials can be almost as good as copper (in one plane) etc, but I don't believe in them for paste, possibly they might be good for film. Besides, if you look at "research" done by overclockers, it all goes the way of thermal compounds a la Arctic Silver, or at least it did when I was keeping up on these things.
My point is that you select a technique that suits you, and if you execute well, you should have a great long-term solution. It helps if the materials are easy to apply, and all these + my Berquist films with integrated "thermal compond" fit that bill. I like the concept of non-conductive materials that do not evaporate, and thick ceramic spacers + flat mating surfaces.
Again, your mileage will vary, and I am probably spending way too much time on this minor point which will minimally influence the sound quality of the finished product.